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1
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NXGWTYODEH42644
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CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-10-18
|
Japan
|
5776 Kgs
|
473 CTN
|
|
2
|
KWEO111040028991
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-18
|
Japan
|
10840 Kgs
|
123 PKG
|
|
3
|
KWEO111040017522
|
CARDBOARD BOX CUSHION ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-13
|
Japan
|
535 Kgs
|
125 CTN
|
|
4
|
KWEO111040028685
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-13
|
Japan
|
8564 Kgs
|
60 CAS
|
|
5
|
NXGWTYODDW59485
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-10-06
|
Japan
|
8700 Kgs
|
720 CTN
|
|
6
|
KWEO111040028674
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-06
|
Japan
|
5355 Kgs
|
126 PKG
|
|
7
|
KWEO111040028766
|
PLASTICS ( . )
|
SEH AMERICA INC M/S SEH AMERICA INC
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-06
|
Japan
|
8256 Kgs
|
80 PKG
|
|
8
|
KWEO111040017511
|
CARDBOARD BOX ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-09-27
|
Japan
|
364 Kgs
|
75 CTN
|
|
9
|
NXGWTYODDR48525
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-09-27
|
Japan
|
5800 Kgs
|
480 CTN
|
|
10
|
KWEO111040028663
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-09-27
|
Japan
|
5984 Kgs
|
46 PKG
|