|
1
|
KWEO111040029363
|
CARDBOARD BOX CUSHION ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-12-08
|
Japan
|
1117 Kgs
|
225 CTN
|
|
2
|
NXGWTYODFK06033
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-12-08
|
Japan
|
5779 Kgs
|
474 CTN
|
|
3
|
KWEO111040029304
|
SILICON WAFER ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN ETSU HANDOTAI CO., LTD.
|
2025-12-08
|
Japan
|
11416 Kgs
|
101 PKG
|
|
4
|
KWEO111040029293
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN ETSU HANDOTAI CO., LTD.
|
2025-12-04
|
Japan
|
5407 Kgs
|
59 PKG
|
|
5
|
NXGWTYODFK04202
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-11-21
|
Japan
|
5800 Kgs
|
480 CTN
|
|
6
|
KWEO111040029352
|
SILICON SQUARE COLUMN ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-11-21
|
Japan
|
1033 Kgs
|
187 CTN
|
|
7
|
KWEO111040029260
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN ETSU HANDOTAI CO., LTD.
|
2025-11-15
|
Japan
|
5153 Kgs
|
96 PKG
|
|
8
|
NXGWTYODES38233
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-11-08
|
Japan
|
2302 Kgs
|
187 CTN
|
|
9
|
KWEO111040074782
|
CARDBOARD BOX CUSHION ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD
|
2025-11-08
|
Japan
|
746 Kgs
|
150 CTN
|
|
10
|
KWEO111040029201
|
PLASTICS ( . )
|
SEH AMERICA INC M/S SEH AMERICA INC
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-11-08
|
Japan
|
8256 Kgs
|
80 PKG
|