1
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DMAL2HK020474
|
INTEGRATED CIRCUITS 105732927 PCS DIODES 13875000 PCS NXP INVOICE NR: 20161212001 20161212002, COMPLIANCE WITH THE INTERNATIONAL PLANT PROTECTION CONVENTION (IPPC) STANDARD ISPM #15
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ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
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2017-02-27
|
China
|
8036 Kgs
|
845 CTN
|
2
|
DMAL2HK011315
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INTEGRATED CIRCUITS 7428764 PCS TRANSITORS 2234530 PCS DIODES 7669000 PCS OTHER PROCESSORS, PROTECTION CONVENTION (IPPC) STANDARD ISPM #15
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ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-12-08
|
Hong Kong
|
1151 Kgs
|
194 CTN
|
3
|
DMAL2HK006395
|
INTEGRATED CIRCUITS 5700195 PCS HTS CODE: 8542390000, 8542399000 NO BATTERY NXP INVOICE NR: 20160801003, 20160801004 CONTAINS WOOD PACKAGING MATERIAL THAT IS IN COMPLIANCE WITH THE INTERNATIONAL PLANT PROTECTION CONVENTION (IPPC) STANDARD ISPM #15
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-10-23
|
China
|
1253 Kgs
|
4 PKG
|
4
|
DMAL2HK004121
|
INTEGRATED CIRCUITS 9016663 PCS DIODES 15346500 PCS TRANSISTOR 11902000 PCS TOTAL: 12PLTS (363CTNS), HTS CODE: 8541100000, 8541100050,8541100070, 8541100080,8541210000, 8541210075,8541210095, 8541218542,8541290000, 8541290075,8542310000, 8542319000,8542390000, 8542399000, NO BATTERY NXP INVOICE NR 20160727001,20160727002 20160727003,20160727004 20160727005,20160801001 20160801002 CONTAINS WOOD PACKAGING MATERIAL THAT IS IN, COMPLIANCE WITH THE INTERNATIONAL PLANT PROTECTION CONVENTION (IPPC) STANDARD ISPM#15
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-09-26
|
Hong Kong
|
2434 Kgs
|
363 CTN
|
5
|
DMAL1HK981760
|
INTEGRATED CIRCUITS 9PLTS/64CTNS HS CODE:854239 NO BATTERY NXP INVOICE NR: 20160520001 20160520002, 20160520003 CONTAINS WOOD PACKAGING MATERIAL THAT IS IN COMPLIANCE WITH THE INTERNATIONAL PLANT PROTECTION CONVENTION (IPPC) STANDARD ISPM #15
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-07-05
|
Hong Kong
|
3999 Kgs
|
64 CTN
|
6
|
DMAL1HK983897
|
INTEGRATED CIRCUITS HTS CODE:854239 NO BATTERY NXP INVOICE NR: 20160606001 TTL:5 PLTS/5 CTNS CONTAINS WOOD PACKAGING, MATERIAL THAT IS IN COMPLIANCE WITH THE INTERNATIONAL PLANT PROTECTION CONVENTION (IPPC) STANDARD ISPM #15
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-07-03
|
Hong Kong
|
1525 Kgs
|
5 CTN
|
7
|
DMAL1HK978633
|
INTEGRATED CIRCUITS DIODES TRANSISTORS HTS CODE:8541210075 8541100070,8541290075 8541100050,8542390000 8541100080,854121,854110, 8541210095,854129,854239 NXP INVOICE NR: 20160426001 20160425001 12PLTS/352 CTNS CONTAINS WOOD PACKAGING MATERIAL THAT IS IN COMPLIANCE WITH THE, INTERNATIONAL PLANT PROTECTION CONVENTION (IPPC) STANDARD ISPM#15
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-06-21
|
Hong Kong
|
2818 Kgs
|
352 CTN
|
8
|
DMAL1HK974340
|
INTEGRATED CIRCUITS DIODES TRANSISTORS HTS CODE:8542390000 NXP INVOICE NR: 2016033001 2016032901
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-05-27
|
China
|
1377 Kgs
|
196 CTN
|
9
|
DMAL1HK971510
|
INTEGRATED CIRCUITS (VARIOUS TELECOMMUNICATION HARDWARE WITH ENCRYPTION WITH LICENCE NO.EL66001853 REF.215544608 1 CTN,20,000PCS) DIODES
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2016-05-06
|
China
|
2159 Kgs
|
341 CTN
|
10
|
DMAL1HK947813
|
INTEGRATED CIRCUITS DIODES TRANSISTORS HTS CODE:8541100080 8541290075,8541100070 8541300080,8541290075 8541210075,854121
|
ROCHESTER ELEC INC
|
NXP SEMICONDUCTORS HK LTD(RDC)
|
2015-11-27
|
China
|
8419 Kgs
|
604 CTN
|