1
|
DMALNGO036061
|
24 DRUMS (ON 6 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 HS CODE 3405.90 9025.11 TEMP.+20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-12-26
|
Japan
|
5304 Kgs
|
24 DRM
|
2
|
DMALNGO035752
|
(ON 6 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-11-12
|
Japan
|
5304 Kgs
|
24 DRM
|
3
|
DMALNGO035555
|
(ON 8 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-10-24
|
Japan
|
6640 Kgs
|
30 DRM
|
4
|
DMALNGO034854
|
(ON 6 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-07-30
|
Japan
|
5304 Kgs
|
24 DRM
|
5
|
DMALNGO034366
|
(ON 10 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-06-04
|
Japan
|
8840 Kgs
|
40 DRM
|
6
|
DMALNGO033953
|
(ON 5 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-04-16
|
Japan
|
4420 Kgs
|
20 DRM
|
7
|
DMALNGO033700
|
(ON 5 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-03-19
|
Japan
|
4420 Kgs
|
20 DRM
|
8
|
DMALNGO033397
|
(ON 5 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-02-20
|
Japan
|
4420 Kgs
|
20 DRM
|
9
|
DMALNGO033136
|
(ON 5 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-01-23
|
Japan
|
4420 Kgs
|
20 DRM
|
10
|
DMALNGO032992
|
(ON 5 PALLETS) SLURRY-AQUEOUS POLISHING/ SEMI-SPERSE W2000 H.S.CODE:3405.90, 9025.11 TEPM. +20C VENTILATION:CLOSED
|
SAMSUNG AUSTIN SEMICONDUCTOR.
|
NIHON CABOT MICROELECTRONICS
|
2014-01-02
|
Japan
|
4420 Kgs
|
20 DRM
|