|
1
|
EMLTHKGS00289630
|
HEAT SINK
|
TRANS EXPEDITE INC
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-12-02
|
Hong Kong
|
220 Kgs
|
44 CTN
|
|
2
|
TFRASHAS25100026
|
THERMAL MODULE
|
QCH, INC., A NEVADA CORPORATION
|
NIDEC CHAUN CHOUNG TECHNOLOGY
|
2025-11-20
|
China
|
2505 Kgs
|
308 CTN
|
|
3
|
FCIFL25T06655LAX
|
THERMAL MODULEHS
|
QCHINC
|
NIDEC CHAUN CHOUNG TECHNOLOGY
|
2025-11-16
|
China
|
1096 Kgs
|
112 CTN
|
|
4
|
EXDO6911630363
|
HEAT SINK FOR ELECTRONICS HTS:
|
CLOUD NETWORK TECHNOLOGY USA INC
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-11-11
|
Hong Kong
|
466 Kgs
|
42 CTN
|
|
5
|
EMLTHKGS00281232
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-11-10
|
Hong Kong
|
1591 Kgs
|
218 CTN
|
|
6
|
EMLTHKGS00280554
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-11-10
|
Hong Kong
|
363 Kgs
|
24 CTN
|
|
7
|
EMLTHKGS00275648
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-24
|
Hong Kong
|
1198 Kgs
|
140 CTN
|
|
8
|
DFDSHKG1354692
|
HEAT SINK USE FOR ELECTRONICAL
|
MFG PRO, TIJUANA, MX C/O JD GROUP
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-21
|
China Taiwan
|
292 Kgs
|
19 CTN
|
|
9
|
EMLTHKGS00272371
|
COMPUTER PARTS (HEAT SINK)
|
TRANS EXPEDITE INC
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-19
|
Hong Kong
|
139 Kgs
|
28 CTN
|
|
10
|
TFRASHAS25090049
|
THERMAL MODULE
|
QCH, INC., A NEVADA CORPORATION
|
NIDEC CHAUN CHOUNG TECHNOLOGY
|
2025-10-17
|
China
|
4868 Kgs
|
600 CTN
|