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8
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CMDUCHN2630615
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ASSEMBLY,NOT INCLUDED CARD READER, PROON ASSEMBLY,NON WEBCAM,PROONE G ASSEMBLY,NO INCLUDED ODD, PROONE G ASSEMBLY,L Z MINI G I WKS ASSEMBLY,HUB,POSSUM ASSEMBLY,HUB,POSSUM ASSEMBLY,HUB,POSSUM, ASSEMBLY,L Z MINI G I WKS PART NO: L - M - M - P - N - N - N - P - PO : INV: H H H H H H H H HS CODE: DELIVERY: SHIPMENT : CARTONS INTO PALLETS HPI-FTZ ONLYALL CHARGES COLLECT AT USA BY HP USA
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INVENTEC ON BEHALF OF HP INC
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INVENTEC CHONGQING CO.,LTD.
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2025-10-09
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China
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6158 Kgs
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20 PKG
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9
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CMDUCHN2630621
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ASSEMBLY,CPU HEATSINK W, Z G I MINI ASSEMBLY,INTGRTD CAM DM MP IR ACS ASSEMBLY,WEBCAM INTEGRATED, MIR+CLS TNR, ASSEMBLY,INTGRTD CAM DM MP ACS ASSEMBLY,JUMANJI -MISC NO WEBCAM, ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,KAZAAM W UMA N-KVM/TOUCH/N- ASSEMBLY,JUMANJI W UMA/TOUCH/ MP ASSEMBLY,BASE UNIT,CAMERA,LANDSCAPE, . ASSEMBLY,HUB,POSSUM ASSEMBLY,USB . GEN ,COIL,CM-CM V/ A, . ASSEMBLY,HUB,POSSUMASSEMBLY,CPU HEATSINK W, Z G I MINI ASSEMBLY,HUB,POSSUM PART NO: P - P - N - P - P - P - P - P - P - M - N - M - N - P - N -PO : INV: H H HH H H H H H H H H H H H HS CODE: DELIVERY: SHIPMENT : CARTONS INTO PALLETS HPI-FTZ ONLY ALL CHARGES COLLECT AT USA BY HP USA
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HP INC. C/O INVENTEC CORPORATION
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INVENTEC CHONGQING CO.,LTD.
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2025-10-09
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China
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12105 Kgs
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42 PKG
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|
10
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CMDUCHN2608552
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SET,BEZEL,DISPLAY,RGB, P BRACKET,TOP,KEYBOARD,SGCC,AMD BRACKET,TOP KB,AMD,SGCC, P CONNECTOR,W TO B, . / . MM,FL, . A,BLK, CONNECTOR,W TO B, . / . MM,ML,NTU, X IC,POWER SWITCH, . . V,SOT- - , P,TR TRANSISTOR-FET,NEMOS, V, . A,DFN -, HINGE-W BRACKET,DISPLAY,LEFT, . MM, . HINGE-W BRACKET,DISPLAY,RIGHT, . MM, . FAN,BLOWER, . MM, V,CCW,PWM, WIRE, THERMAL MODULE,INTEL MTL P,DIS, W, W,D E.SET,FPC+SWITCH, . X . X . HOLDER,BOTTOM IO,LEFT,PC+ABS, INSULATOR,CAMERA,PC,ADHESIVE FAN,BLOWER, . MM, V,CCW,PWM, WIRE,BUTTON,TOP,POWER,PCFR E+TIO ,GRAY BUTTON,TOP,FINGER PRINTS,PCFR E HOLDER,BOTTOM IO,RIGHT,PC+ABS, ASSEMBLY,CASE,BOTTOM,THIN, P ASSEMBLY,KEYBOARD,TOP,SUB,US,BLACK SET,DISPLAY,BEZEL,NON AG,THIN, X SET,DISPLAY,BEZEL,AG, X ASSEMBLY,CASE,BOTTOM,SUB,RJ THICK, WASSEMBLY,CASE,BOTTOM,RJ THICK, W PART NO: H H H H H H H H H H H H H H H H H HH H H H H H PO : INV: H H H H H H H H HH H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO,PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ( ) - CHIH. MX. C.P. JUAREZ CH MEXICO TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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HP INC C/O IEC TECHOLOGIES
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INVENTEC CHONGQING CO
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2025-10-03
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China
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7417 Kgs
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21 PKG
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