Hp Inc. C/o Inventec (Chongqing)

Name: Hp Inc. C/o Inventec (Chongqing) | Ver Envíos Recientes | ImportGenius
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Registros aduaneros de EE.UU para Hp Inc. C/o Inventec (Chongqing), un proveedor ubicado en China. Ver su historial de importaciones y exportaciones, incluyendo envíos de Iec Techologies, S. De R.L. De C.V. en Juarez, Ch.

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Obtén Datos de Estados Unidos por $199

Total Envíos

2,294

Socios Comerciales

Socio principal

IEC TECHOLOGIES, S. DE R.L. DE C.V.

Puertos

Puerto principal

Los Angeles, California

Información de contacto

Hp Inc. C/o Inventec (Chongqing)

Ltd. No. 66 West District 2nd Rd Shapingba District, Chongqing 401331 China

Registros de Hp Inc. C/o Inventec (Chongqing)

Obtén un historial completo del proveedor

Actualizado: 2025-11-16

Total de envíos de 2006-11-01 a 2025-11-17

Los datos precisos y los puntos de datos del gráfico solo están disponibles para los suscriptores pagos

Envíos de proveedor

Principales socios comerciales

Leyenda

Puertos destacados

Leyenda

Los Angeles, California
Long Beach, California
Miami, Florida
Savannah, Georgia
New York/Newark Area, Newark, New Jersey

Total de envíos de 2006-11-01 a 2025-11-17

Los datos precisos y los puntos de datos del gráfico solo están disponibles para los suscriptores pagos

Envíos de proveedor

#	Conocimiento de Embarque	Producto	Importador	Proveedor	Fecha de llegada	País de Origen	Peso Bruto en kilogramos	Cantidad
1	CMDUSHZ7611917	SET,COVER,TOP,PCR ASSEMBLY,CASE,BOTTOM,RJ THICK, W ASSEMBLY,CASE,BOTTOM,NRJ THIN- , TRANSISTOR-FET,NMOSFET, V, A,DFN , P PART NO:H H H H PO :, INV: H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-11-16	China	6513 Kgs	471 CTN
2	CMDUSHZ7611916	SET,COVER,TOP,PCR PART NO:H PO : INV: H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS, ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-11-16	China	6443 Kgs	420 CTN
3	CMDUSHZ7591148	SET,DISPLAY,BEZEL,IR, SET,COVER,A,BLACK SET,POGO,RING,BLACK SET,COVER,A,BLACK SET,BUTTON,VOLUME,BLACK SET,VOLUME,BUTTON SET,AC RING,MALTA, SET,CASE,BEZEL,DISPLAY,METEOR SET,DISPLAY,BEZEL,NON AG, X IC,FLASH MEMORY, M,- + C, . . V, RESISTOR-CHIP, K, , / W, . A, ,TR SET,HOLDER,A SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , MM,MACH, . MM, . MM,CROSS,SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, INSULATOR, MM, MM, . MM, D SHIELD,TOP,ABSORBER,DST- , ,MYLAR INSULATOR,PCB,L SHAPE,PC, . T, W FOAM,LED PCB,CR- , . MM COVER,TOP,POWER,PCFR E+TIO , X SET,HOUSING,BOTTOM SET,HOUSING,BOTTOMASSEMBLY,MODULE,REAR,DISPLAY,WWAN, P,IM PART NO: H H H H H H H H H H H H H H H H H H H H H H H H PO : INV: H H H HH H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-10-25	China	9844 Kgs	650 CTN
4	CMDUSHZ7594033	DIODE,ESD, . V, A,SMD,CSP P Y,TR IC,POWER SWITCH,SOT - , P,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR IC,REDRIVER,DE MUX,WQFN, P,TR IC,CONTROLLER, . V,WLCSP, P,TR IC,BUCK-BOOST CONTROLLER, . V,VQFN,, CAPACITOR-CHIP, UF, V, M,X R, ,TR CAPACITOR-CHIP, UF, V, M,X R, ,TR, . INDUCTOR, . UH, , MHZ, MA, . X X . CAPACITOR-CHIP, UF, V, M,X R, ,TR, .CAPACITOR-AL, UF, V,M, C, . X , / CAPACITOR-CHIP, UF, V,K,X R, ,TR IC,USB TYPE-C PORT CONTROLLER,QFN, P,TR IC,USB CONTROLLER HUB, -PORT, USB . ,QFN, SET,HOLDER,A ASSEMBLY,CASE,TOP,NRJ, PART NO:H HH H H H H H H H H H H H H H H H H PO : INV:H H H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-10-25	China	13254 Kgs	653 CTN
5	CMDUSHZ7461581	ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON ASSEMBLY,TOP,THICK RJ , KEYBOARD,SUB,PCB ASSEMBLY,MODULE,REAR,DISPLAY, WLAN PCB , PART NO:H H, H H H H PO : INV:H H H H HH HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6462 Kgs	486 CTN
6	CMDUSHZ7461583	ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM PART NO:H H H H H PO : INV:H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	7595 Kgs	488 CTN
7	CMDUSHZ7461579	RESISTOR-CHIP, K, , / W, ,TR IC,HUB CONTROLLER,USB . , QFN, P,TR TRANSISTOR-FET,PEMOS, V, MA,SOT , P, DIODE,SCH, V, . A, MW,SMT,, SOT- ,TR BEAD, OHM, , . A, . OHM, INCH, IC,THERMAL SENSOR,ONE, BIT ADC,SOT- , P IC,TEMPERATURE SENSOR, SOT - , P,TR IC,PROTECTION DEVICE,ESD, V,DFN X - L, DIODE-ZNR, . V, . MA, MW,SMD, SOD ,TR TRANSISTOR-FET,PEMOS,- V,- A, DFN X , P DIODE,ESD, V, A, W,SMD, SLP P X F,TR DIODE,ESD, . V, A,SMD,DFN P E,TRDIODE,ESD, . V,SMD,DFN P X,TR IC,ANALOG SWITCH,UQFN, P,TR ASSEMBLY,CASE,BOTTOM,SUB, RJ THICK, W ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON PART NO:H H H HH H H H H H H H H H H H H H H PO : INV:H H H H H H H H H HH H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6360 Kgs	508 CTN
8	CMDUCHN2529205	SET,BEZEL,DISPLAY,IR, W SET,BEZEL,DISPLAY, W,IR CABLE,ROUND, POS, MM,E,MDP TO DP ADAP FAN,BLOWER, . X . X . MM, . CFM, . FRAME,TOP,KEYBOARD,PC+ABS+ TALC,US, ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,CASE,BOTTOM,W/O,RJ , N, PART NO: H H H H H H H H H PO :INV: H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALSALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6745 Kgs	22 PKG
9	CMDUCHN2529193	ASSEMBLY,TOP,THICK RJ ,KEYBOARD,SUB,PCB ASSEMBLY,CASE,BOTTOM,W/O,RJ , N FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, MM CLIP, . MM, . MM, . MM,SUS / H,H= ., CLIP, . MM, . MM, . MM,SUS / H,H= FRAME,SHIELDING,C ,R SHIELD,CPU INL,KU S, N, SHIELD,CPU INL,KU S, N, CABLE,ROUND, POS, MM,E,TBT COMBO PCB,SMART CARD, L,HALONGFREE,ENTEK PCB,ECOM, L,FR ,ENTEK PART NO:H H H H H H H H H H H H H H H H H PO : INV: H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6776 Kgs	23 PKG
10	CMDUCHN2529191	SET,BEZEL,DISPLAY,IR, P SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= BRACKET,TOP,SMART CARD,KU S,AUTO, TOUCH PAD,NO BUTTON, P, . X ,PIKE SIL SPEAKER.W/HOUSING, OHM, . W, X , . X HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , X . KEYBOARD MODULE, ,USB,JACK BLACK,US, SPEAKER.W/HOUSING, OHM, W, X , . XSPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X .SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . THERMAL MODULE,INTEL ARL,UMA, W,CHIPSET SET,TOP,HOUSING SET,FRAME,BTM,MWSSET,BEZEL,DISPLAY,IR, P DUMMY,SMART CARD,TOP,PC+ABS+ TALC, FRAME,TOP,KEYBOARD,PC+ABS+ TALC,UK, HOLDER,BOTTOM IO,RIGHT,PC+ABS+ TALC, HOLDER,TOP,IO R,PC+ABS TALC, P BUTTON,TOP FPR,PC, P FAN,BLOWER, . . . MM, . CFM, . SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,I,M . , . MM,MACH, . MM,. MM,CROSS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,PAN,M . , . MM,MACH, . MM, . MM,CR SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, SCREW,I,M . , . MM,MACHINE, . MM, . MM, SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS PAD, MM, MM, . MM,DENKA BSNA SHIELD,PCB,MAIN,ABSORBER, GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESIGASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR,. CAPACITOR-TA-SP, UF, . V,M,- + C, DIODE,RECT, V, A,SMD,SOD- FL,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RES-CHIP- . K- - / W- -TAP RES-CHIP- K- - / W- -TAP RESISTOR-CHIP, . K, , / W, ,TAP RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, . , , / W, ,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, K, , / W, . A, ,TR RESISTOR-CHIP, ,+/- , / W, ,TR RESISTOR-CHIP, ,+/- , / W, ,TAPRESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, K,+/- , / W, ,TAP RESISTOR-CHIP, ,+/- , / W, ,TR,+/- RESISTOR-CHIP, ,+/- , / W, ,TR,+/ RESISTOR-CHIP, . ,+/- , W, ,TR,+/- RESISTOR-CHIP, . K,+/- , / W, ,TR INDUCTOR, . UH, , KHZ, A, . X XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, M INDUCTOR, . UH,+/- , KHZ, . A, . X . BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, . A, . X . CRYSTAL, MHZ, PPM, PF,SMD, . X . X . CRYSTAL, . KHZ,+/- PPM, . PF,SMD, .CRYSTAL, MHZ,+/- PPM, PF,SMD, . X . X CRYSTAL, . MHZ,+/- PPM, PF,SMD, . X . IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,FLASH MEMORY, M,- + C, . . V, IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,TEMPERATURE SENSOR, . . V,VSSOP, P CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP,. UF, . V,M,X R, ,TRCAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, . V,K,X R, ,TR CAPACITOR-CHIP, . PF, V,C,C G, ,TR, CAPACITOR-CHIP, PF, V,J,C G, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR DIODE,RECT, V, A,SMD,SOD- FL,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , .BEAD- OHM- - . A- . OHM- INCH- INDUCTOR, . UH,+/- , KHZ, A, . X INDUCTOR, . UH,+/- , KHZ, . A, . X . INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, A, X . X INDUCTOR, . UH,+- , MHZ, A, . X . X TRANSISTOR-FET,NEMOS, V, A,DFN X , P,IC,FLASH MEMORY, M,- + C, . . V, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . TRANSISTOR-FET,PEMOS,- V, A,SOT- , P,T IC,ANALOG MUX/DEMUX,X - DFN - , P,TR DIODE,ESD, V,SMD,SOD ,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,FPC,BACK FLIP, . / . MM,FL,NTU RESISTOR-CHIP, . ,+- , W, ,TRRESISTOR-CHIP, . ,+/- , W, ,TR,+- IC,MICROPOWER HALL SWITCH,TSOT - L, P,T IC,AND GATE, . . V, INPUT,SINGLE,TSSO BEAD, OHM, , MA, . OHM, INCH, IC,TEMPERATURE SENSOR,MSOP, P,TR ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H PO : INV: H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETS( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	8350 Kgs	26 PKG

#	Importador	Última dirección	Más Reciente	No. De Contenedores	Peso Bruto en kilogramos
1	IEC TECHOLOGIES, S. DE R.L. DE C.V.	Los Angeles, California	2025-11-16	1073	5327096 Kgs
2	HP INC. C/O XPOLOGISTICS	Los Angeles, California	2024-01-14	800	6746123 Kgs
3	IEC TECHOLOGIES, S. DE R.L. DE C.	Long Beach, California	2025-07-06	248	865193 Kgs
4	HP INC.C/O RYDER LOGISTICS	Los Angeles, California	2018-12-08	58	569469 Kgs
5	HP INC. C/O RYDER LOGISTICS INDY	Long Beach, California	2024-01-14	25	235019 Kgs

#	Proveedor	Última dirección	Más Reciente

Más datos disponibles para subscriptores pagos

Ejemplo de envío de Hp Inc. C/o Inventec (Chongqing)

Conocimiento de Embarque CMDUSHZ7611917

Fecha de llegada: 2025-11-16

Número del Contenedor: ONEU0413459

Cargo #1
Descripción SET,COVER,TOP,PCR ASSEMBLY,CASE,BOTTOM,RJ THICK, W ASSEMBLY,CASE,BOTTOM,NRJ THIN- , TRANSISTOR-FET,NMOSFET, V, A,DFN , P PART NO:H H H H PO : INV: H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
Palabras clave set cover top pcr assembly case bottom rj thick w assembly case bottom nrj thin transistor fet nmosfet v a dfn	Código HS DATOS NO DISPONIBLES	Recuento de piezas 471

Largo 480	Altura 108
Ancho 96	Estado de la Carga Loaded
Sello R7017455	Descripción del Equipo CN
Tipo 40 Foot Dry Container, Opening at one or both end	Tipo de Servicio Pier to Pier
Tipo de Contenedor 40 Foot Dry Container, Opening at one or both end	Marcas y Números N/M

Transportista COMPAGNIE MARITIME D-AFFRETEMENT	Código del Transportista CMDU
Dirección del Transportista 5701 LAKE WRIGHT DR	Número de Contacto del Transportista DATOS NO DISPONIBLES
Buque registrado en DATOS NO DISPONIBLES	Puerto Extranjero YANTIAN
Número de Viaje 0TXLM	País de Origen CHINA
Nombre del buque CMA CGM SYRACUSE	Puerto de EE.UU. DATOS NO DISPONIBLES
Conocimiento de Embarque Maestro CMDUSHZ7611917	Peso (LB/KG) 14361.165 / 6513
Cantidad 471 CTN	Recuento de Contenedores 1
Lugar de Recepción YANTIAN	Puerto de Distribución DATOS NO DISPONIBLES
Conocimiento de embarque de la casa (HBL) vs Conocimiento de embarque maestro (MBL) DATOS NO DISPONIBLES	Medida DATOS NO DISPONIBLES
Tipo de Entrada In-Bond (Depósito Aduanero) 61	Tipo de Código de Facturación In-bond Automated