1
|
CHKMMIA213040675
|
KEY LOCK KL3909
|
INTERGARD R&D LLC
|
HITACHI HIGH-TECHNOLOGIES HONG KONG
|
2013-05-31
|
Hong Kong
|
190 Kgs
|
17 CTN
|
2
|
SQSTSHA0460188
|
TEMPERED GLASS
|
SUNPOWER CORP. MEXICO S DE RL DE CV
|
HITACHI HIGH-TECHNOLOGIES(HONGKONG)
|
2013-03-16
|
China
|
33020 Kgs
|
26 CAS
|
3
|
BANQNKG2049642
|
TEMPERED GLASS
|
FLEXTRONICS INTERNATIONAL USA, INC.
|
HITACHI HIGH-TECHNOLOGIES HONG KONG
|
2012-07-04
|
China
|
16080 Kgs
|
12 PKG
|
4
|
BANQNKG2049154
|
TEMPERED GLASS
|
FLEXTRONICS INTERNATIONAL USA, INC.
|
HITACHI HIGH-TECHNOLOGIES HONG KONG
|
2012-06-19
|
China
|
16080 Kgs
|
12 CAS
|
5
|
SHKK156741916706
|
TEMPERED GLASSTEMPERED GLASSTEMPERED GLASSTEMPERED GLASSTEMPERED GLASSTEMPERED GLASSTEMPERED GLASS
|
N/A
|
HITACHI HIGH-TECHNOLOGIES HONGKONG
|
2012-05-05
|
China
|
113850 Kgs
|
87 CAS
|
6
|
NOVVNPT120400220
|
TEMPERED GLASS
|
SUNPOWER CORPORATION MEXICO S
|
HITACHI HIGH-TECHNOLOGIES HONGKONG
|
2012-04-20
|
China
|
16080 Kgs
|
12 CAS
|
7
|
BANQSZX0225760
|
GLASS 72CELL,3.2MM(NON-AR) 61X31IN XYGSHIPPING NO. JAM11030023JABIL S PO NO.1181231083(1625 PCS)THIS SHIPMENT DOES NOTCONTAIN ANY WOOD PACKAGINGMATERIALS
|
JABIL CIRCUIT INC C O IBM CORP
|
HITACHI HIGH-TECHNOLOGIES HONG KONG
|
2011-05-02
|
China
|
16600 Kgs
|
13 PCS
|
8
|
BANQSZX0215501
|
9 CASESGLASS 128-CELL,3.2X1040X2060MM NAR, XYG9 CASESGLASS 128-CELL,3.2X1040X2060MM NAR, XYG9 CASESGLASS 128-CELL,3.2X1040X2060MM NAR, XYGSHIPPING NO. JAM11020020JABIL S PO NO.1181225788JABIL S PO NO.1181225789THIS SHIPMENT CONTAINSWOOD PACKAGING MATERIALTHAT IS STAMPED WITHTHE IPPC MARK AS PERISPM#15 REQUIREMENTSSEDENO ST.COR.VALERO ST,SALCEDO VILLAGE, MAKATICITY, PHILIPPINES 1200MR.NOEL/MS.SHARONTEL (632)751-5137(632)753-3665/67/68
|
JABIL CIRCUIT INC C O IBM CORP
|
HITACHI HIGH-TECHNOLOGIES HONG KONG
|
2011-03-20
|
China
|
47400 Kgs
|
27 PCS
|