|
1
|
SQSTSIS0226887
|
EXPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
COOKSON SEMICONDUCTOR PACKAGING
|
COOKSON SEMICONDUCTOR PACKAGING
|
2010-05-26
|
Singapore
|
5740 Kgs
|
395 CTN
|
|
2
|
SQSTSIS0224070
|
EPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
COOKSON SEMICONDUCTOR PACKAGING
|
COOKSON SEMICONDUCTOR PACKAGING
|
2010-04-08
|
Singapore
|
9322 Kgs
|
608 PK
|
|
3
|
SQSTSIS0218958
|
TODI CAS 91-97-4, 2929102000EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERSEPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS(NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2010-01-05
|
Singapore
|
10147 Kgs
|
671 CTN
|
|
4
|
SQSTSIS0217962
|
TODI CAS 91-97-4, 2929102000EPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2009-12-22
|
Singapore
|
8334 Kgs
|
567 CTN
|
|
5
|
SQSTSIS0218372
|
TODI CAS 91-97-4, 2929102000MOLD CLEANING COMPOUND (NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2009-12-22
|
Singapore
|
1660 Kgs
|
150 CTN
|
|
6
|
SQSTSIS0214582
|
EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERSEPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS(NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2009-10-27
|
Singapore
|
10897 Kgs
|
720 CTN
|
|
7
|
SQSTSIS0211983
|
EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERSEPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS(NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2009-09-08
|
Singapore
|
10879 Kgs
|
720 CTN
|
|
8
|
SQSTSIS0207192
|
EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERSEPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS(NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2009-06-23
|
Singapore
|
4708 Kgs
|
324 CTN
|
|
9
|
SQSTSIS0208216
|
EPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2009-06-23
|
Singapore
|
5348 Kgs
|
386 CTN
|
|
10
|
SQSTSIS0204205
|
EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERSEPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS(NON HAZARDOUS)
|
N/A
|
COOKSON SEMICONDUCTOR PACKAGING
|
2009-04-11
|
Singapore
|
5755 Kgs
|
396 CTN
|