1
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HYSLFSZX11101215
|
PLASTIC BOX FOR IC WAFER SHIPMENT WITHFOAM TYVEK
|
INTEGRATED DEVICE TECHNOLOGY,INC.
|
EPAK MULTI PRODUCTS FACTORY
|
2011-11-06
|
China
|
1602 Kgs
|
229 CTN
|
2
|
HYSLFSZX11050021
|
PLASTIC BOX FOR IC WAFER
|
INTEGRATED DEVICE TECHNOLOGY INC
|
EPAK MULTI PRODUCTS FACTORY
|
2011-05-23
|
China
|
1279 Kgs
|
182 CTN
|
3
|
PSLAMGSOAK15060
|
MACHINE PARTS-ATE RECEIVER ARM-DC SOURCE XFR 60-20-SYSTEM DC ELECTRONIC LOAD HP6050A-TRIPPLE OUTPUT DC POWER SUPPLY
|
INTEGRATED DEVICE TECHNOLOGY, INC
|
Integrated Device Technology (M)
|
2011-03-30
|
Singapore
|
500 Kgs
|
1 CRT
|
4
|
HYSLFSZX10120938
|
PLASTIC BOX FOR IC WAFER SHIPMENT FOAM TYVEK
|
INTEGRATED DEVICE TECHNOLOGY INC
|
EPAK TECHNOLOGIES(SHENZHEN)CO.,LTD
|
2011-01-16
|
China
|
1863 Kgs
|
275 CTN
|
5
|
HYSLFSZX10070376
|
FOAM DISC TYVEK
|
INTEGRATED DEVICE TECHNOLOGY INC
|
EPAK TECHNOLOGIES(SHENZHEN)CO.,LTD
|
2010-08-01
|
China
|
915 Kgs
|
137 CTN
|
6
|
HYSLFSZX10020049
|
PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAM
|
INTEGRATED DEVICE TECHNOLOGY INC
|
EPAK MULTI PRODUCTS FACTORY
|
2010-02-24
|
China
|
3046 Kgs
|
446 CTN
|
7
|
HYSLFSZX09110263
|
PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAM304CTNS IN 10 PLASTIC PALLETS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
EPAK MULTI PRODUCTS FACTORY
|
2009-11-29
|
China
|
2006 Kgs
|
304 CTN
|
8
|
HYSLFSZX09090218
|
PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAM
|
INTEGRATED DEVICE TECHNOLOGY INC
|
EPAK MULTI PRODUCTS FACTORY
|
2009-09-27
|
China
|
1141 Kgs
|
164 CTN
|
9
|
ANQISZX090001327
|
PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAMSAME
|
INTEGRATED DEVICE TECHNOLOGY, INC.
|
EPAK MULTI PRODUCTS FACTORY
|
2009-03-25
|
China
|
1130 Kgs
|
164 CTN
|
10
|
ANQISZX081251767
|
PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAMSAME
|
INTEGRATED DEVICE TECHNOLOGY INC.
|
EPAK MULTI PRODUCTS FACTORY
|
2008-12-28
|
South Korea
|
1134 Kgs
|
164 CTN
|