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1
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FLEQ01IPH0058539
|
SOLDER WIRES (SILVER - SEMI MANUFACTURED) SOLDER WIRES (ELECTRODES)
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-10
|
Singapore
|
509 Kgs
|
1 CAS
|
|
2
|
FLEQ01IPH0058424
|
SOLDER WIRES (ELECTRODES)
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-10
|
Singapore
|
532 Kgs
|
1 CAS
|
|
3
|
SEINSOATL25J1686
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: . , . , . , .
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HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-12-03
|
Japan
|
2113 Kgs
|
502 PKG
|
|
4
|
KWEO560240097624
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-01
|
Malaysia
|
1387 Kgs
|
7 WDC
|
|
5
|
FLEQ01IPH0058015
|
SOLDER WIRES & SOLDER POWDER SOLDER WIRES (SILVER - SEMI MANUFACTURED) & SOLDER WIRES (ELECTRODES)
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-11-24
|
Singapore
|
1426 Kgs
|
4 CAS
|
|
6
|
SHPT90527838
|
SOLDER POWDER DANGEROUS SOLDER POWDER NON DANGEROUS HS CODE
|
HARIMATEC INC
|
IPS INDUSTRIE DES POUDRES
|
2025-11-21
|
France
|
3320 Kgs
|
46 PKG
|
|
7
|
SEINSOATL25I1676
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE : . , .
|
HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-10-29
|
Japan
|
2174 Kgs
|
120 PKG
|
|
8
|
KWEO560240096460
|
SOLDER WIRE (SILVER-SEMI MANUFACTURED) HS CODE: . . SOLDER WIRES (ELECTRODES) HS CODE: . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-10-27
|
Malaysia
|
2064 Kgs
|
4 WDC
|
|
9
|
YASVPRG0029291
|
BRAZING MATERIAL HYBRAZ MB HS: INV: FV , FV UN TOXIC LIQUID, PG , CLASS , KG
|
HARIMATEC, INC.
|
HARIMATEC CZECH S R O
|
2025-10-23
|
Germany
|
2613 Kgs
|
3 PAL
|
|
10
|
FLEQ01IPH0057669
|
WOODEN CASES OF SOLDER POWDER SC AGP SOLDER POWDER KG MY ISC AGP SOLDER POWDER KG MY L
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-10-10
|
Singapore
|
1075 Kgs
|
2 CAS
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