1
|
MLCWTPEH10007830
|
IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) 5 PALLETS = 16 DRUMS HS CODE:8542.90
|
FREESCALE SEMICONDUCTOR INC
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2018-12-15
|
China Taiwan
|
2105 Kgs
|
16 DRM
|
2
|
MLCWTPEH10007294
|
IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) 6 PALLETS = 23 DRUMS HS CODE:8542.90
|
FREESCALE SEMICONDUCTOR INC
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2018-09-07
|
China Taiwan
|
2654 Kgs
|
23 DRM
|
3
|
MLCWTPEH10004599
|
LOT 01. IC DEVICE W/ ENCAPSULATION, PLASTIC LOT 33B. BLUE TAPE (MYLAR) SCRAP DIE (INKED) LOT 243. LEAD FRAMES WITHOUT 4 PALLETS = 15 DRUMS
|
FREESCALE SEMICONDUCTOR, INC
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2016-11-30
|
China Taiwan
|
2326 Kgs
|
15 DRM
|
4
|
MLCWTAO16080364
|
NO#42 LEFTOVER MATERIAL OF BGA NO#39 SUBSTRATE OF BGA NO#228 LEAD FRAME WITH MOLDING COMPOUND ( CU NO#204 LEAD FRAME WITHOUT MOLDING COMPOUND ( CU) NO#1 IC DEVICE W/ ENCAPSULATION, PLASTIC NO#41 IC OF BGA, NO#31 WAFER WITH DIE (BROKEN) NO#253 SOLDER SPHERE OF BGA NO#33A BLUE TAPE (MYLAR) NO#33B: SCRAP DIE (INKED)
|
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2016-09-15
|
China
|
9481 Kgs
|
46 PKG
|
5
|
MLCWTAO16070362
|
NO#42 LEFTOVER MATERIAL OF BGA NO#228 LEAD FRAME WITH MOLDING COMPOUND ( CU NO#204 LEAD FRAME WITHOUT MOLDING COMPOUND ( CU) NO#1 IC DEVICE W/ ENCAPSULATION, PLASTIC NO#41 IC OF BGA NO#31 WAFER WITH DIE (BROKEN), NO#203 COPPER WIRE - BARE (NO INSULATION) NO#201 ALUMINUM WIRE NO#33A BLUE TAPE (MYLAR) NO#33B: SCRAP DIE (INKED)
|
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2016-09-01
|
China
|
6126 Kgs
|
33 PKG
|
6
|
NPNEBRHOAOE38927
|
RORO 2 COLLI SCREW COMPRESSOR LOADED INTO 2 CASES TYPE 2 X ZR15A2-10,4-60 DIMS 2 X 392 X 238 X 278 CMS DETAILS AS PER INVOICE 562238 WITH REF NO I56025, FREIGHT PREPAID
|
FREESCALE SEMICONDUCTOR
|
ATLAS COPCO AIRPOWER NV
|
2016-08-08
|
Belgium
|
14850 Kgs
|
2 PKG
|
7
|
MLCWTPEH10004292
|
LOT 37 BURN OR TEST BOARDS, TEST CIRCUIT BOARD, 2 LOT 38 LOAD BOARD, 3 LOT.01 IC DEVICE W/ ENCAPSULATION, PLASTIC 4 LOT 33 BLUE TAPE (MYLAR) WITH OR WITHOUT DIE, 29PKGS = 4PLTS(12DRUMS)+ 25CTNS =37PKGS
|
FREESCALE SEMICONDUCTOR, INC.
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2016-07-16
|
China Taiwan
|
2448 Kgs
|
37 PKG
|
8
|
MLCWTAO16060355
|
LEFTOVER MATERIAL OF BGA LEFTOVER MATERIAL OF INK DIE SCRAP BLUE TAPE SCRAP LEAD FRAME SCRAP SUBSTRATE OF BGA SCRAP IC SCRAP WAFER WITH DIE
|
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2016-07-01
|
China
|
5887 Kgs
|
31 PKG
|
9
|
MLCWTAO16040362
|
LEFTOVER MATERIAL OF BGA SCRAP SOLDER SPHERE OF BGA LEFTOVER MATERIAL OF INK DIE SCRAP BLUE TAPE SCRAP LEAD FRAME SCRAP SUBSTRATE OF BGA SCRAP IC
|
FREESCALE SEMICONDUCTOR INC.
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2016-05-30
|
China
|
10326 Kgs
|
51 PKG
|
10
|
PYRDKUL168285138
|
ENGINEERING BOX
|
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR MALAYSIA
|
2016-05-01
|
China
|
340 Kgs
|
50 BDL
|