1
|
PRIM2G108094
|
SCRAP MOLDING COMPOUND,SCRAP IC,SCRAP LEADFRAME
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA)LIMIT
|
2011-08-26
|
South Korea
|
5877 Kgs
|
24 PKG
|
2
|
BGNL53101860
|
SCRAP SUBSTRATE SCRAP LEADFRAME SCRAP IC SCRAP MOLDING COMPOUND
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA) LIMI
|
2011-08-05
|
South Korea
|
7577 Kgs
|
32 PKG
|
3
|
PRIM2G106119
|
SCRAP SOLDER BALL OF BGA SCRAP SUBSTRATE SCRAP LEAD FRAME SCRAP MOLDING COMPOUND SCRAP IC
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA)LIMIT
|
2011-06-30
|
South Korea
|
2913 Kgs
|
14 PKG
|
4
|
PRIM2G105103
|
SCRAP SOLDER BALL OF BGA SCRAP SUBSTRATE SCRAP IC SCRAP LEADFRAME SCRAP MOLDING COMPOUND
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA)LIMIT
|
2011-06-01
|
South Korea
|
4037 Kgs
|
16 PKG
|
5
|
BGNL53100685
|
SCRAP LEFTOVER SUBSTRATE SCRAP SOLDER BALL OFBAG SCRAP SUBSTRATE SCRAP LEAD FRAME
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA) LIMI
|
2011-05-12
|
China
|
3456 Kgs
|
15 PKG
|
6
|
ULGIULGI21102035
|
SCRAP LEFTOVER SUBSTRATE SCRAP SUBSTRATE SCRAP LEAD FRAME(WITHOUT M/C) SCRAP LEAD FRAME(WITH M/C) SCRAP MOLDING COMPOUND SCRAP IC SCRAPWAFER WITH DIE SCRAP LID SCRAP HEADER
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA)LIMIT
|
2011-03-22
|
China
|
10953 Kgs
|
42 PKG
|
7
|
ULGIULGI21101107
|
SCRAP LEFTOVER SUBSTRATE SCRAP SUBSTRATE SCRAP WAFER WITH DIE SCRAP SOLDER BALL SCRAP LEADFRAME(WITHOUT M/C) SCRAP WAFER WITH DIE SCRAPMOLDING COMPOUND
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA)LIMIT
|
2011-02-23
|
China
|
4299 Kgs
|
20 PCS
|
8
|
ULGIULGI21012041
|
SCRAP LEFTOVER SUBSTRATE SCRAP SUBSTRATE(BGA)SCRAP WAFER WITH DIE SCRAP SOLDER BALL SCRAPWAFER WITH DIE SCRAP LEADFRAME(WITHOUT M/C)SCRAP LEADFRAME(WITH M/C) SCRAP WAFER WITH DIE SCRAP MOLDING COMPOUND SCRAP WAFER WITH DIESCRAP ICSCRAP LEFTOVER SUBSTRATE SCRAP SUBSTRATE(BGA)SCRAP WAFER WITH DIE SCRAP SOLDER BALL SCRAPWAFER WITH DIE SCRAP LEADFRAME(WITHOUT M/C)SCRAP LEADFRAME(WITH M/C) SCRAP WAFER WITH DIE SCRAP MOLDING COMPOUND SCRAP WAFER WITH DIESCRAP IC
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA)LIMIT
|
2011-01-15
|
China
|
21787 Kgs
|
91 PKG
|
9
|
ULGIULGI21010061
|
SCRAP LEFTOVER SUBSTRATE SCRAP SUBSTRATE SCRAP SOLDER BALL SCRAP WAFER WITH DIE SCRAP LEADFRAME(WITHOUT M/C) SCRAP LEAD FRAME(WITH M/C) SCRAP LEAD FRAME(WITH M/C) SCRAP LEAD FRAME(WITHOUT M/C) SCRAP MOLDING COMPOUND SCRAP LEAD FRAME (WITH M/C) SCRAP IC
|
ECOTHECH RECYCLINE LLC
|
FREESCALE SEMICONDUCTOR(CHINA)LIMIT
|
2010-11-26
|
China
|
14993 Kgs
|
61 CTN
|