|
1
|
TGFHTTPE6735077
|
04 LAYER PRINTED CIRCUIT BOARD34CTNS=1PLTHS CODE# 8534.00
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2024-07-19
|
China Taiwan
|
251 Kgs
|
34 CTN
|
|
2
|
TGFHTTPE6728367
|
04 LAYER PRINTED CIRCUIT BOARD67 CTNS = 2 PLTSHS CODE# 8534.00
|
SAMSUNG INTERNATIONAL ,INC.(C360)
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2024-07-12
|
China Taiwan
|
501 Kgs
|
67 CTN
|
|
3
|
TGFHTTPE6684466
|
04 LAYER PRINTED CIRCUIT BOARD
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2024-06-09
|
China Taiwan
|
401 Kgs
|
54 CTN
|
|
4
|
TGFHTTPE6649452
|
04 LAYER PRINTED CIRCUIT BOARD44 CTNS = 1 PLTHS CODE# 8534.00
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2024-05-02
|
China Taiwan
|
319 Kgs
|
44 CTN
|
|
5
|
TGFHTTPE6604643
|
04 LAYER PRINTED CIRCUIT BOARD
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2024-03-22
|
China Taiwan
|
1247 Kgs
|
168 CTN
|
|
6
|
TGFHTTPE6584991
|
04 LAYER PRINTED CIRCUIT BOARD
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2024-02-25
|
China Taiwan
|
1485 Kgs
|
200 CTN
|
|
7
|
TGFHTTPE6505641
|
04 LAYER PRINTED CIRCUIT BOARDINVOICE NO.212B21103262CTNS=2PLTSHS CODE# 8534.00AMS HBL NO.TTPE6505641SCAC# TGFH
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2023-12-08
|
China Taiwan
|
448 Kgs
|
62 CTN
|
|
8
|
TGFHTTPE6482917
|
04 LAYER PRINTED CIRCUIT BOARDINVOICE NO.212B21008135CTNS=1PLTHS CODE# 8534.00AMS HBL NO.TTPE6482917SCAC#TGFH
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2023-11-17
|
China Taiwan
|
248 Kgs
|
35 CTN
|
|
9
|
TGFHTTPE6482913
|
04 LAYER PRINTED CIRCUIT BOARD19CTNS=1PLTSHS CODE# 8534.00
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2023-11-17
|
China Taiwan
|
118 Kgs
|
19 CTN
|
|
10
|
TGFHTTPE6474984
|
04 LAYER PRINTED CIRCUIT BOARD
|
N/A
|
UNIMICRON TECHNOLOGY CORP(HSIN-FENG
|
2023-11-09
|
China Taiwan
|
354 Kgs
|
49 CTN
|